System Design Intern, LDE - 2027
Skills and tasks
Suggested skills
- High-speed board bring-up and lab measurement
- Signal Integrity (SI) and Power Integrity (PI) modeling
- Thermal and mechanical co-design integration
Skill-to-task connections are not available yet.
Tasks from the posting
GPU product board design
You + AIHardware bring-up and debugging
Your edgeCross-functional engineering interface
Your edgeCircuit simulation and diagnosis
You + AIIndustry standards architecture research
You + AICadence schematic tool execution
AI does it
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More analysis and source details
58% is classified as human or shared work.
Your edge · 3 things
- Physical hardware bring-up and bench testing using oscilloscopes, logic analyzers, and thermal probes.
- Cross-functional trade-off negotiations between thermal, mechanical, signal integrity, and silicon teams.
- Real-time fault isolation on physical prototype printed circuit boards.
Surging global capital expenditure in data center infrastructure and AI accelerators directly drives hardware design headcount. The physical complexity of high-speed system design continues to outpace automated design rule checkers.
Do this week
- High-speed board bring-up and lab measurementHands-on lab equipment mastery isolates hardware engineers from software-only automation.
- Signal Integrity (SI) and Power Integrity (PI) modelingMastering transmission line physics commands top-tier compensation in hardware design.
- Cadence Allegro / Concept HDLCadence, Concept, OrCAD design entry and layout.
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